27 plates flat wafer biscuit machine production line

KHG-27 Flat wafer biscuit machine production line which is one of KeHua company's traditional products used in product different kind of good wafer, and the capacity is about 2.18t/24h. This line had been more reliably and mature via innovative improvements on the basis of advanced technology within this 20 years.

Baking type: 1. Gas(LNP or LGP),

                       2. Electricity(380V/3 phase/50Hz).

The standard configuration of this wafer biscuit machine production line: batter mixer, baking oven, wafer sheet connecting machine, wafer sheet cooler, wafer sheet collecting machine, cream spreading machine, wafer book conveyor, wafer cutting machine, cream mixer, wafer smashing machine.

Production Process:

               batter mixing ---- wafer baking ---- cooling ---- cream spreading ---- book cooling ---- cutting

Equipment:

       1. batter mixer  2. baking oven  3. wafer sheet connecting machine  4. wafer sheet cooler

       5. wafer sheet collecting machine  6. cream spreading machine  7. wafer book conveyor

       8. wafer cutting machine  9. cream mixer  10. wafer smashing machine

Products Distinguishing Feature:

(1) The oven has 27 plates and they made of nodular cast iron, the standard dimension of baking plate is 470×325mm. The power transistor and travelling wheel have the Chinese patent, the line have PID temperature automatic control system and the good affect for wafer sheet.

(2) Batter mixer is made of Stainless Steel. It can mixing 65kg batter with 25kg flour and 40kg water within 5 minutes.

(3) Vertical type wafer cooler is made of Stainless Steel and using the own motor.

(4) The racks of cream spreader are the stainless steel tank, the motor and pneumatic component which both seal in the tank have good waterproof and dustproof. The spreader has the easy clear design.

(5) Wafer cooling tower is made of Stainless Steel, and the part which touch the wafer book are all made of Stainless Steel 304. The cooling fan is outlay and the temperature of cooler’s inlet air are 5°C. The relative humidity of cooling tower is 55%.

(6) Wafer cutter is mechanically and the maximum speed of cutting wafer book(filled with cream) are 8 books.

This line is exclusively used in produce different kind of good wafer.

Technical advantage:

1) In the field of wafer machines have more than 15 years experiences.

2) According to HACCP design, the controlling and operating for the important equipment will be more accurately and safely.

3) Have CE, ISO9001:2000, FM.

4) Professional design, material selection more scientifically, processing more accurately.

5) Good quality.

6) Best service and perfect after sale service.

Technical Parameter:

1) The standard size of the baking plate is 470×325mm; Pattern(standard) is 2.5×2.5×0.5mm

2) The size of wafer sheet is 464×321mm, The effective cutting size of wafer sheet is 456×315mm.

3) Wafer sheet’s thickness: 2.5mm---3.2mm.

4) Weight of wafer sheet: 50---60g

5) Rated power: 30kw

6) Air compression: 0.9cube/minute

7) Baking time about 2 minutes

8) Worker: 5 people